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Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
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TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available
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Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs
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Parade Extend USB-C MUX and DeMUX Devices for USB 3.2 with 20 Gbps DisplayPort 2.1 Support: PS8838 / PS8839 enable DP 2.1 over USB-C
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Ambarella Launches 4K, 5nm Edge AI SoC for Mainstream Security Cameras With New Highs in AI Performance Per Watt, Image Quality and Sensor Fusion
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GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance
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XMOS launches the XVF3800: high-performance voice processor for collaboration applications
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