Macnica GmbH News

Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022

josef.sigl — Thu, 25 May 2023 08:46:27 +0000

Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022

Winbond

josef.sigl Thu, 05/25/2023 - 09:46

May 25th, 2023

Taichung, Taiwan - 2022-12-09 - Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that it has been awarded the 7th China IoT Technology Innovation Award 2022 by Elecfans for its continuous pursuit of technological innovation and excellent product performance with the launch of its next generation memory product HYPERRAM™ 3.0.

Established by Elecfans, a leading electronic media in China, the China IoT Innovation Awards has been recognized as one of the most professional, influential evolutions in Chinese IoT industry. The China IoT Innovation Awards aims to discover and recognize outstanding technologies and leaders in the IoT industry, as well as innovative products that have been highly valued and recognized by the market and industry users in the past years, so as to inspire more people to empower the advancement of IoT technology and development of the industry.

The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM. HYPERRAM 3.0 is the third generation of the HYPERRAM family that operates at a maximum frequency of 200MHz with a 1.8V operation voltage, which is the same as both HYPERRAM 2.0 and OCTAL xSPI RAM, but with an increased datatransfer rate of 800MBps – double the rate that was previously available. The new generation HYPERRAM operates via an expanded IO HYPERBUS™ interface with 22 pins.

Low pin count, low power consumption and easy control are three key features of HYPERRAM that help it significantly improve the performance of IoT end devices. HYPERRAM significantly simplifies the PCB layout design, extends mobile devices' battery life, and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM.

According to IResearch, China's AIoT industry has entered a period of rapid growth in 2022, with a corresponding surge in demand for IoT chips and smart devices. The HYPERRAM 3.0 won the China IoT Technology Innovation Award is a high recognition of Winbond's continuous innovation. The HYPERRAM family is ideal for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.

Availability and Pricing
Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
More information may be found at https://www.winbond.com/hq?__locale=en

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copy-rights mentioned herein are the property of their respective owners.

Downloads

Attachment	Size
Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022	803.74 KB
Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022	986.98 KB

TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available

josef.sigl — Thu, 25 May 2023 05:41:01 +0000

TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available

TDK InvenSense

josef.sigl Thu, 05/25/2023 - 06:41

May 23rd, 2023

T5838 and T5837 PDM microphones offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode
SmartSound One provides a plug-and-play evaluation interface for Digital I²S and PDM and Analog MEMS Microphones

January 03, 2023

TDK Corporation (TSE:6762) announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform. These MEMS microphones push the boundaries of microphone acoustic performance, power efficiency, and advanced feature sets all in small package footprints. SmartSound One offers a solder-free, plug-and-play interface to evaluate and develop multiple types and configurations of microphones.

The T5837 and T5838 PDM MEMS microphones offer the world’s lowest power Pulse Density Modulation (PDM) multi-mode MEMS microphone with high acoustic overload point (AOP) of 133 dB SPL, high signal-to-noise ratio (SNR) 68 dBA, and wide dynamic range ideal for environments that shift from very quiet to very loud, such as far field voice pickup for smart speaker to ANC TWS applications.

T5837, a very low power wide dynamic range PDM digital microphone with industry standard features:
Multiple modes of operation such as high quality, low-power (Always On), ultrason-ic, and sleep mode
High quality mode offers an SNR of 68 dBA while only consuming 310 µA of supply current at 1.8V
Low-power (Always On) mode offers an SNR of 65.5 dBA while only consuming 120 µA of supply current at 1.8V
Targeted to smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, and security and surveillance market

T5838, a very low power wide dynamic range PDM digital microphone with new acoustic activity detect (AAD) features:

Industry-leading acoustic performance, modes of operations, and low current draw as seen on the T5837
Acoustic activity detect (AAD), a new ultra-low power edge processing feature where the microphone monitors the acoustic environment and when activity is detected, can wake up the main SoC or application processor out of a deep power down mode. This can maximize system battery life. The AAD is available with three modes of operation starting at just 20 µA, providing user programmability for various filters and thresholds to optimize performance for each application
Targeted to smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, security and surveillance markets, high-end voice activated remote controls, and voice-activated equipment

SmartSound One is a USB plug-and-play microphone interface module that enables rapid evaluation and development of TDK Analog and Digital MEMS microphone solutions. Users can plug in up to two microphones to transmit high quality stereo audio using standard audio packets over the USB connection and can capture this audio using their favorite software for later playback or detailed real-time analysis.

Glossary

TWS:	True wireless stereo	HQM:	High quality mode
LPM:	Low power mode	AOP:	Acoustic overload point
SNR:	Signal to noise ratio	SPL:	Sound pressure level
AAD:	Acoustic activity detect	PDM:	Pulse density modulation

Availability and Pricing
The SmartSound One is compatible with PDM digital, I²S digital, single-ended ana-log, and differential analog TDK microphones supplied on a flexible PCB. T5838 and T5837 are available in small 3.5 × 2.65 × 0.98 mm bottom port packaging.
Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About TDK Corporation
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to com-mercialize ferrite, a key material in electronic and magnetic products.

TDK‘s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more.

These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2022, TDK posted total sales of USD 15.6 billion and employed about 117,000 people worldwide.

About InvenSense
InvenSense, a TDK Group company, is a world-leading provider of Sensing Solutions. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions.

InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products.

InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.
For more information visit https://invensense.tdk.com/.

Downloads

Attachment	Size
TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available	1.65 MB
TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available	2.27 MB

Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs

josef.sigl — Thu, 27 Apr 2023 11:43:13 +0000

Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs

Lattice Semiconductor

josef.sigl Thu, 04/27/2023 - 12:43

April 27th, 2023

Expands control FPGA leadership into next-gen control functions for Communications, Computing, and Industrial applications with hardened PCIe interfaces

HILLSBORO, Oregon (USA) – Apr. 18, 2023 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced the Lattice MachXO5T™-NX family of advanced system control FPGAs designed to address customer challenges related to growing system management design complexity. The latest low power FPGAs based on the Lattice Nexus™ platform, MachXO5T-NX FPGAs feature advanced connectivity with PCIe®, increased logic and memory resources, and enhanced security. Combined with class-leading power efficiency, size, and reliability, these new low power FPGAs bring Lattice’s long-standing leadership in control FPGAs to a broader set of control function designs and applications for enterprise networking, machine vision, and industrial IoT.

“As the pace of technological innovation accelerates and system management designs become more complex, the need for advanced processing capabilities increases,” said Dan Mansur, Vice President, Product Marketing, Lattice Semiconductor. “Lattice MachXO5T-NX FPGAs equip our customers with more capacity, faster I/O, and enhanced security features in the low power, small size envelopes to help them simplify system integration while maintaining power efficiency, compatibility, and performance.”

Key features and performance highlights of the new low power Lattice MachXO5T-NX FPGAs include:

Control FPGAs with PCIe

Featuring hardened PCIe Gen 2 interfaces between the host processor and the control FPGA.

Increased logic and memory resources

Up to 3.4X more embedded memory (7.2 Mb) than competing FPGAs of a similar class, minimizing the need for external memory.
Up to 100X more dedicated user flash memory (57 Mb) than competing FPGAs of a similar class to store mission-critical data and parameters.
Up to 100X lower soft error rate than competing FPGAs of a similar class, improving system reliability for safety-critical applications.

Robust programmable I/O

Address challenges of modern CPUs and SoCs lacking the robust 3.3 V I/O signaling support required to communicate with many other devices in system.
Feature up to 291 general purpose I/O that support early I/O configuration and provide added features such as 1.25 Gbps SGMII, default pull-down, hot socketing, and programmable slew rate for simplified board design.

Class-leading security

On-chip multi-boot with bitstream encryption (AES256) and authentication (ECC256).
Run-time security capabilities not currently available in competitive FPGAs of a similar class.

For more information about the technologies mentioned above, please visit:

Lattice MachXO5T-NX; Lattice Nexus-Platform; Lattice Radiant-Software

Availability and Pricing
MachXO5T-NX FPGAs are sampling today and are supported by the latest release of Lattice Radiant® design software. Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing Communications, Computing, Industrial, Automotive, and Consumer markets.

Our technology, long-standing relationships, and commitment to world-class support let our customers quickly and easily unleash their innovation to create a smart, secure, and connected world.

For more information about Lattice, please visit https://www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook, YouTube, WeChat or Weibo.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity.

Downloads

Attachment	Size
Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs	1.71 MB
Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs	1011.16 KB

Parade Extend USB-C MUX and DeMUX Devices for USB 3.2 with 20 Gbps DisplayPort 2.1 Support: PS8838 / PS8839 enable DP 2.1 over USB-C

josef.sigl — Tue, 18 Apr 2023 09:08:53 +0000

Parade Extend USB-C MUX and DeMUX Devices for USB 3.2 with 20 Gbps DisplayPort 2.1 Support: PS8838 / PS8839 enable DP 2.1 over USB-C

Parade Technologies

josef.sigl Tue, 04/18/2023 - 10:08

March 30th, 2023

San Jose, Calif. – 29 March 2023 – Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of the PS8838 USB 3.2 / DP 2.1 MUX and PS8839 USB 3.2 / DP 2.1 DeMUX for commercial and consumer PCs, host systems and peripherals.

PS8838 features a DisplayPort 2.1 and USB 3.2 Gen 2×1 MUX with retiming, targeting USB-C host systems and docks. PS8839 is a DeMUX/Retimer device optimized for sink applications including docks and peripherals. The PS8838 and PS8839 are fully compliant with USB-IF USB 3.2 specification supporting up to Gen 2×1 or 10Gbps and VESA DP 2.1 standard up to UHBR20. The devices support low power consumption for standby and low power states, greatly extending the battery life of mobile devices and enabling system EnergyStar compliance.

“PS8838/PS8839 extend DP 2.1 support to Parade USB-C MUX and DeMUX product families,” says Jimmy Chiu, Executive VP of Marketing at Parade Technologies. “OEMs can now upgrade their host and peripheral solutions with DP 2.1 with proven technologies from Parade.”

Availability and Pricing
The PS8838 and PS8839 are sampling now. They are available in a 4.7×8.0mm 62-pin QFN package. Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Parade Technologies
Parade Technologies, Ltd. is a leading supplier of mixed-signal ICs for a variety of increasingly used high-speed and display interface standards used in network and storage systems, computers, automotive, consumer electronics, and display panels. Parade is a fabless semiconductor company founded in 2005 and publicly listed on Taipei Exchange (TPEx) in 2011 (stock code: 4966). Parade’s portfolio of signal conditioning IC products serves the growing demand for high speed data integrity solutions for HDMI™, DisplayPort™, USB, and PCI Express interface applications.

Parade leverages its close relationships with market leading Tier-1 OEMs to develop ICs that enable competitive system capabilities. Parade is also a key contributor to industry standards development organizations. The company’s devices integrate proprietary technologies that offer superior signal integrity as well as improved system integration and power efficiency. As a result of the company’s “standards-plus” design philosophy, Parade ICs have been designed into products offered by nearly every leading computer and display vendor worldwide.

For more information, go to https://www.paradetech.com/.

Downloads

Attachment	Size
Parade Extend USB-C MUX and DeMUX Devices for USB 3.2 with 20 Gbps DisplayPort 2.1, PS8838 / PS8839 enable DP 2.1 over USB-C	1.22 MB
Parade Extend USB-C MUX and DeMUX Devices for USB 3.2 with 20 Gbps DisplayPort 2.1, PS8838 / PS8839 enable DP 2.1 over USB-C	987.82 KB

Ambarella Launches 4K, 5nm Edge AI SoC for Mainstream Security Cameras With New Highs in AI Performance Per Watt, Image Quality and Sensor Fusion

josef.sigl — Tue, 28 Mar 2023 11:43:09 +0000

Ambarella Launches 4K, 5nm Edge AI SoC for Mainstream Security Cameras With New Highs in AI Performance Per Watt, Image Quality and Sensor Fusion

Ambarella23

josef.sigl Tue, 03/28/2023 - 12:43

March 28th, 2023

CV72S SoC Increases On-Camera Intelligence Via New CVflow® 3.0 Architecture, Radar Sensor Fusion, Color Night Vision and Better HDR for Single, Fisheye and Multi Imagers

SANTA CLARA, Calif., March 21, 2023 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced in advance of ISC West the CV72S 4K, 5nm AI vision system-on-chip (SoC) for mainstream professional security cameras, built on its latest CVflow® 3.0 AI architecture. That architecture allowed Ambarella to create this new CV72S SoC with the security industry’s highest AI performance per watt and fusion of radar and camera data, for better nighttime and all-weather AI perception. Its dedicated AI hardware efficiently runs the latest transformer neural networks (NNs), which now outperform convolutional NNs for many vision tasks. Additionally, the CV72S offers 6x greater AI performance than its predecessor, enabling it to also run Ambarella’s groundbreaking AISP for neural net-work-enhanced 4K, long-range color night vision and HDR at very low lux levels with minimal noise and no external illumination, while leaving plenty of headroom for additional, concurrent NNs (e.g., person tracking and mask detection). As a result of the CVflow architecture’s efficiencies, combined with 5nm process technology, the CV72S consumes less than 3W of power, offering the mainstream security market’s highest AI performance per watt.

“Ambarella’s CV72S fits perfectly into the ongoing trend for security cameras to integrate more and more AI capabilities at the edge via camera processors, while maintaining a low power and thermal budget,” commented Florian Domengie, Senior Technology & Market Analyst, Imaging at Yole Intelligence, part of Yole Group. “The growth of infrastructure cameras powered by a processor with advanced AI acceleration is expected to increase significantly in the coming years, with a CAGR22-27 of 23% (1).”

“To take their mainstream professional security cameras to the next level, designers are looking for a solution that provides more AI performance, better image quality and the ability to cover wider areas, across weather and lighting conditions without increasing power budgets,” said Fermi Wang, President and CEO of Ambarella. “We are accelerating their innovation by offering our latest CVflow 3.0 architecture and 5nm process technology in the new CV72S SoC, which was purpose built for the mainstream security market using our algorithm-first approach and in-depth knowledge of vision processing, radar and AI.”

Through its deep understanding and experience in the security market, Ambarella designed the CV72S to also enable higher-end cameras with advanced 16MP30 fisheye dewarping and 4x 5MP30 multi-imager AI capabilities. For single-imager cameras, the CV72S supports 4KP60 encoding for AVC and HEVC—a 2x performance increase over its predecessor. These features are ideal for a broad range of mainstream security cameras, including smart city and traffic applications, as well as monitoring crowded areas (e.g., retail stores, malls and stadiums). Additionally, the CV72S provides rich details for human viewing while enabling advanced video analytics such as long-distance object detection and license plate recognition.

Ambarella’s in-house Oculii™ virtual aperture imaging (VAI) AI radar technology equipped the company with the know-how to integrate hardware acceleration into the CV72S for fusion with camera data, as well as dynamic load switching between radar and cameras. Ambarella’s Oculii technology features 10-100x better radar resolution than any other radar solution on the market today. These radar capabilities are particularly important for applications such as perimeter security and nighttime monitoring, as well as any system that needs to operate in rain, snow or fog. Additionally, radar can accurately measure the distance, speed and direction of separate objects over a long range, for applications such as traffic cameras.

Other features of the new CV72S SoC include a 2x increase in CPU performance over the prior generation, via dual Arm® Cortex-A76 1.6GHz cores. It also features 2x the DRAM bandwidth, with support for 32-bit LPDDR4x/LPDDR5/LPDDR5x DRAM. Additionally, this SoC integrates hardware security to prevent hacking, including secure boot, OTP and Arm TrustZone technology. The CV72S also has new high-speed PCIe and USB 3.2 interfaces, enabling more complex, multichip security system designs.

Ambarella’s CVflow AI development platform provides a full set of tools for easy porting, and supports all common CV frameworks. With its rich set of features, as well as Ambarella’s tools that are compatible across its entire AI security portfolio, the CV72S lowers design costs and maximizes software reuse.

Availability and Pricing
The new CV72S SoC is available now for sampling, and will be demonstrated during ISC West 2023 in Las Vegas. Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Ambarella
Ambarella’s products are used in a wide variety of human vision and edge AI applications, including video security, advanced driver assistance systems (ADAS), electronic mirror, drive recorder, driver/cabin monitoring, autonomous driving and robotics applications.

Ambarella’s low-power systems-on-chip (SoCs) offer high-resolution video compression, advanced image and radar processing, and powerful deep neural network processing to enable intelligent perception, fusion and planning. For more information, please visit https://www.ambarella.com.

All brand names, product names, or trademarks belong to their respective holders. Ambarella reserves the right to alter product and service offerings, specifications and pricing at any time without notice. © 2023 Ambarella. All rights reserved.

Downloads

Attachment	Size
Ambarella Launches 4K, 5nm Edge AI SoC for Mainstream Security Cameras With New Highs in AI Performance	2.45 MB
Ambarella Launches 4K, 5nm Edge AI SoC for Mainstream Security Cameras With New Highs in AI Performance	995.74 KB

GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance

josef.sigl — Tue, 21 Mar 2023 11:54:08 +0000

GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance

GigaDevice

josef.sigl Tue, 03/21/2023 - 11:54

March 21st, 2023

GD25UF series featuring single 1.2V supply offers industry's lowest Active Read power consumption
GD25UF's 1.2V capability enables a direct interface to SoCs and processors produced on advanced process nodes, reducing their die size and simplifying their power supply architecture

Nuremberg, Germany – 14 March 2023 – GigaDevice, a semiconductor industry leader in Flash memory and 32-bit microcontrollers serving a broad range of technology innovations, today introduced the GD25UF series of SPI NOR Flash in its strategic roadmap of 1.2V Flash products supporting systems-on-chip (SoCs) and applications processors built on advanced process nodes. The GD25UF SPI NOR Flash products are optimized for applications that require ultra-low power consumption or a small board footprint.

The GD25UF products operate at a supply-voltage range of 1.14V-1.26V .This is ideal for devices built on advanced process nodes and operating at a core voltage of 1.2V, as it provides for a simpler power system architecture, and for direct interfacing between the I/O pins of the SoC or processor and the GD25UF device.

With the GD25UF products, GigaDevice provides better specifications than other competing 1.2V products in the parameters that manufacturers of mobile communications devices, wireless modems and wearable devices care most about. In low-power mode at a frequency of up to 50MHz, Active Read current can be as low as 0.4mA at slower frequencies. Deep power-down current of 0.1µA makes the GD25UF ideal for any battery-powered or wearable application. In addition, industry-best program and erase times help increase device manufacturing throughput while reducing system power consumption.

In Fast Read mode, these Flash devices operate at up to 120MHz and achieve a data-transfer rate of up to 480Mbits/s. In low EMI mode, operating at 60MHz over a double transferrate (DTR) quad I/O interface, the GD25UF products achieve the same data-transfer rate of 480Mbits/s while minimizing clock-generated noise, an ideal feature for noise-sensitive wireless applications.

Syed S. Hussain, Flash BU Global Segment Marketing of GigaDevice said: “Users of chips manufactured at advanced process nodes require a new generation of low-voltage Flash memory products that are optimized for the demanding applications that they support, such as IoT devices, mobile phones, PCs and laptops, and consumer devices, e.g. portable healthcare, smart watch and battery-based devices. Today’s launch of the GD25UF64E 1.2V Flash product marks the start of a comprehensive roadmap of low-voltage Flash products from GigaDevice, providing OEMs with the mix of memory capacities, serial interfaces and security functions that they need for the next generation of system designs. There is a Megatrend, where one shrinks SoCs down to lowest process geometry a must requirement is peripherals needs to support 1.2VIO also. GigaDevice is uniquely positioned to win Ultra-low power and performance megatrend in new designs.”

Availability and Pricing
The 64Mbit GD25UF64E is in production now. It is supplied in SOP8, 3mm x 4mm or 4mm x 4mm USON8 and WLCSP packages, or as a known good die. The 128Mbit GD25UF128E is sampling. Products with memory capacity of 32Mbits and 256Mbits are in development. Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About GigaDevice
GigaDevice Semiconductor Inc. (SSE Code: 603986) is a world-leading fabless supplier founded in April 2005 and headquartered in Beijing, China. In addition to our branches and offices in many regions and countries such as Shanghai, Shenzhen, Hefei, Xi'an, Chengdu, Suzhou, Hong Kong, the US, South Korea, Japan, the UK, Germany, and Singapore, GigaDevice's global sales network also provides our customers with fast, high-quality and localized services.

GigaDevice's management system is ISO 9001 and ISO 14001 certified. GigaDevice has also forged strategic partnerships with leading foundries and packaging and testing plants as part of our active efforts to promote industry integration. In the future, GigaDevice will continue to focus on smart edge technology with a strategy of “sensor-storage-computing-control-connectivity.” GigaDevice will promote technological innovation and industrial advancement in semiconductors through enhanced upstream and downstream partnerships and optimization of supply chain management.

For more information, go to https://www.gigadevice.com/.

Downloads

Attachment	Size
GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance	1.03 MB
GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance	1009.01 KB

XMOS launches the XVF3800: high-performance voice processor for collaboration applications

josef.sigl — Thu, 09 Mar 2023 09:21:09 +0000

XMOS launches the XVF3800: high-performance voice processor for collaboration applications

XMOS

josef.sigl Thu, 03/09/2023 - 09:21

March 9th, 2023

Faster time to market and cost-optimisation for enterprise and consumer conferencing platforms.

BRISTOL, UK – 6 March 2023 - XMOS today announces the launch of its XVF3800 voice processor, designed to deliver a high-performance, rapid time-to-market solution for enterprise and consumer voice conferencing platforms.

He four-microphone processor is intended to enable Microsoft Teams and Zoom certification in conferencing devices, video bars, portable speakerphones, PCs, gaming monitors and collaborative display solutions. State of the art algorithms provide high-quality audio in challenging environments, while the processor itself enables engineers to fully optimise performance based on the specific acoustics of the product at hand.

Key features include:

Acoustic echo cancellation (AEC) – removes far-end echoes picked up by the microphones, which enables the XVF3800 to extract clear voice signals even with high-volume speaker output
Adaptive multiple beamformers – tracks both stationary and non-stationary voice sources, identifying the direction of arrival, and isolating the voice of interest, improving double talk and dereverberation performance
Noise suppression – nulls diffuse noise sources (air conditioning, road noise etc.) to enable accurate, consistent voice capture
Automatic gain control (AGC) – ensures a consistent far-end volume for speakers at different distances from the device.

Beyond the specialised microphone interface and two supporting linear mic arrays, the XVF3800 also incorporates USB2.0 connectivity, as well as an I2S audio interface that can sample at 16kHz or 48kHz.

“The modern workforce has more disparate and flexible work environments than ever before, and so has never had higher expectations for its communications tools”, commented Aneet Chopra, EVP Marketing & Product Management, XMOS. “With this in mind, enterprise and consumer software providers like Microsoft Teams, and Zoom, are raising the bar to match these expectations. Turnkey solutions that are high performance and easy to integrate are needed to keep pace with new innovations and experiences.”

“The XVF3800 provides a reliable, cost-optimised solution for collaboration applications, delivering the price-to-performance ratio needed to bring new innovations to the market rapidly and successfully.”

Availability and Pricing
The XVF3800 is currently available to early access customers and will be generally available, along with a development kit, the XK-VOICE-SQ66, in the next quarter. The new, cost-optimised processor builds on the success of XMOS’ high performance VocalFusion range.

Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About XMOS
A deep tech company at the leading edge of the intelligent internet of things (IoT), XMOS addresses the evolving market need for flexible compute to serve an ever-widening range of smart things including voice, imaging, and ambient sensing.

The company’s uniquely flexible xcore processors allow product designers to architect system-on-chip solutions purely in software, enabling faster time to market with differentiated systems that are cost-effective and energy efficient.

For more information, go to https://www.xmos.ai/.

Downloads

Attachment	Size
XMOS launches the XVF3800: high-performance voice processor for collaboration applications	1.52 MB
XMOS launches the XVF3800: high-performance voice processor for collaboration applications	1008.4 KB

Parade Technologies Expands USB Hub Product Line with Enhanced Security Features

josef.sigl — Thu, 02 Mar 2023 10:12:39 +0000

Parade Technologies Expands USB Hub Product Line with Enhanced Security Features

Parade Technologies

josef.sigl Thu, 03/02/2023 - 10:12

March 2nd, 2023

New PS5510 4-Port SuperSpeed+ Hub features 10Gbps support for USB-C and legacy (Type-A) connections plus hardware security features

San Jose, Calif. – 22 February 2023 – Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, today announced a new offering in its high-speed connectivity product category. The PS5510 which is an updated version of the FL5500 USB hub controller featuring ultra-low power operation and hardware-accelerated secure firmware updates.

PS5510 is compliant with the USB 3.2 Specification and offers 5 SuperSpeed+ ports (1 up/4 down), each capable of providing 10Gbps data connectivity. The upstream port and 2 downstream ports support the features required for USB-C connections while all of the ports may be used for legacy USB Type-A connections. One additional USB 2.0-only port is provided for an additional hard-wired device, often needed in the target applications.

With its ultra-low power operation and on-chip RSA/SHA-256 hardware to support secure in-field firmware upgrades, PS5510 is ideal for port expansion on USB4 and Thunderbolt^TM docking solutions as well as monitors and mini-docks/dongles. The on-chip MPU provides ample firmware space to handle whatever the application demands. Hardware support for embedded devices (HID, Billboard, etc) and both GPIO and standard interfaces(SPI, I2C) ensure both flexibility and performance.

“Parade continues to show our dedication to supporting our customers with connectivity solutions that provide the right mix of features and performance,” said Jimmy Chiu, Executive VP of Marketing at Parade Technologies. “By offering the PS5510 we are responding to the needs of our customers for a flexible and cost-effective hub with the latest features and proven compatibility.”

Availability and Pricing
The PS5510 is offered in a 10x10mm QFN package. Samples are available now. Also available is the PS5510V for automotive applications as well as the pin-compatible PS5507(V), which offers the same features but without 10Gb/s support (max 5Gb/s). Fore more information availability and pricing please visit email: sales.europe@macnica.com.

Parade is a fabless semiconductor company founded in 2005 and publicly listed on Taipei Exchange (TPEx) in 2011 (stock code: 4966). Parade’s portfolio of signal conditioning IC products serves the growing demand for high speed data integrity solutions for HDMI™, DisplayPort™, USB, and PCI Express interface applications.

Parade leverages its close relationships with market leading Tier-1 OEMs to develop ICs that enable competitive system capabilities. Parade is also a key contributor to industry standards development organizations. The company’s devices integrate proprietary technologies that offer superior signal integrity as well as improved system integration and power efficiency. As a result of the company’s “standards-plus” de-sign philosophy, Parade ICs have been designed into products offered by nearly every leading computer and display vendor worldwide.

For more information, go to https://www.paradetech.com/.

Downloads

Attachment	Size
Parade Technologies Expands USB Hub Product Line with Enhanced Security Features	1.35 MB
Parade Technologies Expands USB Hub Product Line with Enhanced Security Features	988.25 KB

Genesys Logic Announces Industry’s First PCI Express to SD 8.0 Memory Card Reader Controller Support SD 4.0 UHS-II Speed Mode – GL9767

josef.sigl — Thu, 26 Jan 2023 09:12:07 +0000

Genesys Logic Announces Industry’s First PCI Express to SD 8.0 Memory Card Reader Controller Support SD 4.0 UHS-II Speed Mode – GL9767

Genesys Logic

josef.sigl Thu, 01/26/2023 - 09:12

January 26th, 2023

Genesys Logic, Inc., a leading IC design company in mixed-signal, high-speed I/O technologies, today announced GL9767, its high-performance SD Express memory card reader controller.

GL9767 is a PCI Express to SD Express card reader controller. The major applications are the internal SD Express card reader of laptop, mini PC, Server system, professional camera, game console and drone devices that demand the high speed of the SD storage or the second SSD-like storage for the real memory expansion.

GL9767 support 1-Lane 2.5 / 5.0 / 8.0 GT/s PCI Express bus connect to the PCI Express host. The support of SD Express interface can be up to SD 8.0 SD Express (PCIe Gen.3 x 2) by a specific system design and the bandwidth is 1970 MB/s. GL9767 also support SD 7.1 SD Express (PCIe Gen. 3 x 1) and the bandwidth is 985 MB/s. GL9767 can work with the new SDUC card featuring capacities of up to 128 TB.

GL9767 is the first SD Express card reader controller which can backward support SD 4.0 UHS-II speed mode. The existing devices support UHS-II card slot use GL9767 in the next generation product not only upgrade the speed of SD storage also retain the fully support of UHS-II card. GL9767 also support SanDisk high-performance UHS-I card up to 200 MB/s of reading speed.

For power saving, GL9767 support PCI Express ASPM, L1 sub-states (L1.1 and L1.2) and RTD3 (Runtime D3 Hot/Cold), Modern Standby and S0ix.

Availability and Pricing
GL9767 will be entering mass production in the second quarter of 2023. The design kit and the IC sample are available now. Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Genesys Logic
Genesys Logic is a fabless IC design house and specializes in high-speed interface technologies used in consumer and computing applications. Our core competency lies in the development and application of high-speed SerDes technology. In addition to USB4®/3.2 technology, we have put a lot of effort into researching and developing other gigabit SerDes interface technology to keep up with the trend of the new cross-disciplines and cross-platform technologies, and grasp the opportunities in the application markets.

Genesys Logic provides a complete range of products based on the USB4®/3.2/2.0, SD 7.0/4.0/3.0, PCIe Gen4/Gen3 interfaces for multiple application areas. We continuously live up to the market leadership and product innovation, and actively develop high-end manufacturing processes, and diverse niche products with high added values. We are also expanding the applications of our products in the niche market through specification differentiation, improved product quality, and higher implementation to enrich our product lines and improve margins for better market competitiveness.

To maintain a competitive advantage in our products and help our customers gain more product advantages, Genesys Logic is continuously introducing more advanced process technology and implementing copper process in our main products. In the future, we will build a more close relation with the industry chain in the semiconductor ecosystem and integrate our strategic partners' resources to expand our market share in the vertical application market and quickly deliver added-values to end customers.

For more information, go to www.genesyslogic.com.tw/en/index.php.

Downloads

Attachment	Size
GL9767 PCI Express to SD 8.0 Memory Card Reader Controller Support SD 4.0 UHS-II Speed Mode	1.43 MB
GL9767 PCI Express to SD 8.0 Memory Card Reader Controller Support SD 4.0 UHS-II Speed Mode	1.34 MB

New Products: 1-cell Li-ion Battery Protection ICs, NB7141 Series, World's First Product with Built-in Watchdog Timer, and NB7140 Series, Product with Forced Reset Function

josef.sigl — Thu, 19 Jan 2023 11:36:55 +0000

New Products: 1-cell Li-ion Battery Protection ICs, NB7141 Series, World's First Product with Built-in Watchdog Timer, and NB7140 Series, Product with Forced Reset Function

Nisshinbo Micro Devices Inc.

josef.sigl Thu, 01/19/2023 - 11:36

January 19th, 2023

Nisshinbo Micro Devices Inc. has launched two new series of 1-cell Li-ion battery protection ICs. These are the NB7141 series, the world's first(*1) product with built-in watchdog timer, and the NB7140 series, a product with a forced reset function.

December 1st, 2022

Devices that use 1-cell Li-ion batteries, such as wearable/hearable devices, hearing aids, and health devices, have a growing market due to the proliferation of VR/AR (Virtual Reality/Augmented Reality) devices and increasing health awareness. Furthermore, demands for safety improvement are increasing as people wear those devices directly, and safety measures are also becoming more important for the protection functions of batteries.

These two new products feature industry-leading high-accuracy overcharge, overdischarge, and discharge overcurrent detection functions for 1-cell batteries, as well as a forced standby function. In addition, 0 V battery charging inhibition voltage of the two new ICs is configurable more flexibly than that of conventional ones. Furthermore, the NB7140 series has a forced reset function, and the NB7141 series is the world's first 1-cell protection IC equipped with a watchdog timer function. They contribute to the competitiveness of customers' Li-ion battery applications with high accuracy, low consumption, improved safety, and small dimensions.

Features

1. World's First Product with Built-in Watchdog Timer (NB7141)
Incorporating a watchdog timer makes it possible to externally monitor a microcontroller in case of uncontrolled operation. This eliminates the need for additional specialized ICs and reduces mounting area. Compared to a watchdog timer embedded in a microcontroller, it can ensure more safety because there is no risk of watchdog timer malfunction due to common causes with the microcontroller.

2. Forced Reset Function (NB7140)
Using the RST (reset) terminal enables to turn off the charge and the discharge FETs, which makes the leak test of the protection circuit easily. Additionally, installing the RST terminal allows the system power supply to be cut off by turning off the FETs when a microcontroller runs out of control, which can reset the power supply to the microcontroller. This improves the stability of the system.

3. Industry-leading High-accuracy Two-step Discharge Overcurrent Detection
Discharge overcurrent detection voltage 1:
0.005 V to 0.030 V, Accuracy: ±1.0 mV,
0.0305 V to 0.050 V, Accuracy: ±1.5 mV

Discharge overcurrent detection voltage 2:
0.011 V to 0.060 V, Accuracy: ±2.0 mV,
0.0605 V to 0.100 V, Accuracy: ±4.0%

The low voltage and higher accuracy of the overcurrent detection allows using a sense resistor with low resistance. This reduces the impedance of a battery pack, thereby reducing the heat generation at high currents and simplifying the thermal design of a board.

4. Industry-leading High-accuracy Overcharge Detection
Detection voltage range: 4.2 V to 4.7 V, Accuracy: ±15 mV. The improved accuracy contributes to strengthening safety in the trend of charging voltage increase.

5. Industry-leading High-accuracy Overdischarge Detection
Detection voltage range: 2.1 V to 3.2 V, Accuracy: ±35 mV. This contributes to longer battery life by enabling the remaining battery charge to be used as close to an allowable value as possible.

6. Industry-leading Low Supply Current
(Normal Mode)
NB7140: Typ. 1.5 μA / Max. 3.0 μA (25% improvement compared to our con-ventional product),
NB7141: Typ. 2.0 μA / Max. 4.0 μA

(Standby Mode)
Max. 0.04 μA (Overdischarge detection latch type),
Max. 0.20 μA (Overdischarge detection auto release type)
A long operating time of applications is achieved thanks to low supply current at normal mode and standby mode.

7. High-accuracy 0 V Battery Charging Inhibition Voltage
Setting range: 1.0 V to 2.5 V, Accuracy: ±4.0%
Since charging 0 V batteries (low-voltage batteries) may cause an internal short circuit, it can meet the demand for detailed settings of the inhibition voltage from a safety viewpoint.

8. Forced Standby Function
The STB (standby) terminal makes it possible to enter forced standby mode without putting batteries into overdischarge state, which reduces current consumption significantly until a charger is connected. This makes it possible to minimize battery loss during inventory periods prior to product shipment.

9. Package
An ultra-thin, ultra-small and leadless package WLCSP-8-P10 (1.6 × 1.0 × 0.3 mm) is adopted.

Main Specifications

Availability and Pricing
Fore more information availability and pricing please visit email: sales.europe@macnica.com.

About Nisshinbo Micro Devices Inc.
Nisshinbo Micro Devices Inc. is the result of the integration of former New Japan Radio Co., Ltd. and former RICOH Electronic Devices Co., Ltd. Both companies, having contributed to expanding the Nisshinbo Group's microdevices business so far, will further grow as an "Analog Solution Provider" for growing markets by strengthening our structure and achieving synergies through business integration.

Nisshinbo Micro Devices will provide analog solutions through electronic devices and microwave products based on the strength of analog technology in accordance with the Nisshinbo Group's corporate philosophy of "Change and Challenge! For the creation of the future of Earth and People". We will contribute to developing connected society, and aim to be a company with value and presence that is expected by customers around the world.

For more information, go to https://www.nisshinbo-microdevices.co.jp/en/.

Downloads

Attachment	Size
New Products: 1-cell Li-ion Battery Protection ICs, NB7140 and NB7141	1.38 MB
New Products: 1-cell Li-ion Battery Protection ICs, NB7140 and NB7141	1.31 MB